PAGE CONTENTS
Objectives
– Target to enhance performance of single-Phase Mechanically Pumped Fluid Loops
– Reducing pump size or speed/load by optimizing flow at the heat exchanger wall.
– Increase the TRL from 3 to 4
– Increase the heat exchanger performance, with a target of a factor of 4 or more per unit area
Challenges
An electrohydrodynamically (EHD) enhanced cooling loop heat exchanger breadboard model was designed, manufactured and tested integrated with and externally pumped fluid loop and related Ground Support Equipment Test-Bed.
The main challenge in this project was the development towards a cost-efficient product, while improving performance of existing cooling loops.
Technically, this needed to be translated into materials and manufacturing methods that do not compromise the performance or cost in later stages of development of this new type of new heat exchanger, while implementing redundancy and meeting 3 W/K thermal coupling for 35W/cm2.
System Architecture
This heat exchanger will be located in the mechanically pumped fluid loop in close connection to high power hotspots. It consists of fluidic interfaces to the fluidic loop, screwed interface to the load and flying leads. The casing includes the EHD components within internal flow path.
Plan
The development work was divided in 4 major work packages:
– Requirements & Feasibility
– Breadboard heat exchanger design
– Manufacturing, test and verification
– System performance analysis & trade-off
The milestones were Design Review, Test Readiness Review and Final Review
Current Status
The project is finalized and has successfully collected a complete technical specification based on requirements from satellite primes, built and verified a BBM reaching TRL4, with performance mapped in a parameter space covering several applications. Areas for improvement are identified and a plan for reaching TRL 5/6 within 18 months is defined.
