PAGE CONTENTS
Objectives
The goal of the project is to develop the breadboard that will utilise a Pulsating Heat Pipe (PHP) device to transfer heat efficiently from the chip to the module’s interface. The breadboard delivered by contractors will include: PHP, Printed Circuit Boards (PCB) with chip mock-up and chassis. Various PHP design solutions will first be evaluated through thermal testing to identify the most suitable configuration. The selected candidate will then undergo a full environmental test campaign to verify the proposed design. Performed activities will contribute to achieving Technology Readiness Level (TRL) 5.
Benefits
Building on KP Labs’ expertise in advanced onboard systems and satellite payload data processing, PHP technology can support the development of future edge computing and autonomous satellite platforms, enabling higher onboard processing capability and reliable operation in a demanding space environment.
The implementation of PHP technology will allow KP Labs to develop and manufacture high-performance data processing units where thermal limitations will no longer represent a key operational constraint. Improved thermal efficiency will ensure stable operation under sustained high computational loads, directly increasing processing performance and overall system reliability.
Key advantages of the PHP thermal device include:
• Enhanced thermal performance enabled by distributed heat transport and larger effective heat exchange interfaces, allowing the PHP to act as a heat spreader and potentially outperform conventional heat pipes.
• High geometric flexibility, enabling routing of flow channels and adaptation to different PCB layouts.
• Simplified design and manufacturing compared to traditional heat pipes, as PHPs do not require wick or mesh structures.
• Improved low-temperature operability using fluids which remain operational below 0°C, unlike water commonly used in traditional heat pipes
• Orientation-independent operation when properly designed.
Features
The PHP is the core element of the solution and enables highly efficient two-phase heat transport. The PHP shall transport 60 W at 70°C while maintaining a temperature difference of no more than 5°C, corresponding to a thermal resistance of 0.08 K/W. The device shall operate over a wide temperature range from -30°C to + 90°C and maintain operation independently of orientation under ground test conditions.
The PHP structure should be mechanically robust and leak-tight, ensuring integrity under mechanical loads. In addition to the PHP, the thermal interfaces on both the evaporator and condenser sides are key elements. These interfaces are designed to enable simple integration of the thermal solution while minimizing impact on the electronic assembly.
Together, these components form a scalable thermal solution that enables simple integration, high reliability, and consistent thermal performance across a wide range of operating conditions.
Challenges
The main challenges expected in the development of PHP include:
o Achieving demanding thermal performance to keep the chip within a safe operating range;
o Ensuring stable operation in any orientation and within defined operating constraints;
o Manufacturing a sealed device capable of withstanding high internal pressures, ensuring long-term hermeticity and stable performance throughout its operational lifetime;
o Adapting the technology to the specific application constraints;
o Ensuring that the PHP solution does not adversely affect chip lifetime.
System Architecture
The Smart Chip Cooling breadboard is composed of the following elements:
o Pulsating Heat Pipe;
o Evaporator Attachment System;
o Condenser Attachment System;
o Representative electronic module.
The PHP is the core element of the solution and enables highly efficient two-phase heat transport. It is implemented as a flat plate pulsating heat pipe, manufactured from a solid plate with a network of capillary-sized machined channels. The channels are partially filled with a working fluid, which undergoes continuous evaporation and condensation, generating an oscillating two-phase flow. An important part of the architecture is the thermal interfaces on both the evaporator and condenser sides, as they must ensure efficient heat transfer and allow straightforward integration of the PHP with an electronic module. The last part of the system is the electronic assembly that represents the target application and consists of a module including the chassis, PCB, and the chip, from which the PHP removes the heat.
Plan
The implementation is structured in a sequence of design, manufacturing, and verification activities. The project starts with the detailed design and development of dedicated breadboards, followed by their manufacturing and assembly. After producing the breadboards, several PHP variants will be thermally tested to identify the best-performing and most robust solution. Based on the test results, the final configuration will be selected and refined. The selected PHP configuration will then be integrated into an electronic breadboard simulating the target application and will undergo a full environmental and performance test campaign, leading to comprehensive verification and validation of the proposed design.
Current Status
KP Labs specialises in the development of advanced onboard data processing units and high-performance computing solutions for satellite platforms. Its technologies enable efficient in-orbit data handling and real-time payload processing for demanding space missions.
KP Labs, in collaboration with Wrocław University of Science and Technology, has developed a large form-factor Pulsating Heat Pipe under the MITIGATE project (ESA Contract No. 4000141251/23/NL/KML), providing a validated technological foundation now being adapted toward chip-level cooling. The current project builds on this heritage by scaling and miniaturising the PHP technology for space electronic modules.
