Large Optical MEMS Switches Architectures for Broadband Applications

STATUS | Completed
STATUS DATE | 27/02/2014
ACTIVITY CODE | 5C.011
Large Optical MEMS Switches Architectures for Broadband Applications

Objectives

Large Scale Optical Cross Connect
The development consists of a MEMS-based Optical Cross Connect (OXC) with about 50 input and 50 output fibres. One important application of this OXC is an enabling component for a reconfigurable switching network within a communication satellite. The 2 year objective was to deliver a breadboard to prove the soundness of the concept and to demonstrate a working MEMS-based OXC.

An important longer-term objective is to use the knowledge developed in this program to create a Swiss industrial source for MEMS-based OXCs.

The following schematic shows the general concept of the complete switching system. Input and output of the system is in the RF domain, while the core switching is in the optical domain. The RF signal are converted to optical signals prior to the actual optical switching. After the optical switching the are re-converted into the RF domain. The optical switching makes the overall system potentially very compact at very low cross talk and low insertion loss levels.


click for larger image

Challenges

The key issue in the project is to develop a 2D electrostatic actuated MEMS micromirror array of 128 mirrors which is extreme stable in position over time to avoid heavy and complex feed back loop. Another task is to develop the necessary high port count collimator. And last but not least a training strategy and software for the switch matrix.

Plan

Work Package Expected Duration Main Actor Other Actors
WP1000: Assessment of large MOEMS switch architecture  2 Months Alcatel Space Sercalo, IMT, EPFL
WP1100: trade-off architectures  2 Months Alcatel Space IMT, EPFL
WP1200: Conceptual design  2 Months Sercalo IMT, EPFL
WP2000: Preliminary Design of breadboard  2 Months Sercalo IMT, EPFL
WP3000: Detailed design of breadboard and test set  14 Months Sercalo  
WP3100: Detailed design of breadboard  14 Months Sercalo IMT, EPFL
WP3200: Detailed design of test set  3 Months Alcatel Space EPFL, Sercalo
WP4000: manufacturing  15 Months Sercalo IMT, Alcatel Space, EPFL
WP4100: MOEMS manufacturing  15 Months Sercalo IMT, EPFL
WP4200: test bed manufacturing  5 Months Alcatel Space Sercalo
WP5000: Test campaign  3 Months Alcatel Space Sercalo
WP6000: Appraisal  1 Month EPFL Alcatel Space, Sercalo, IMT

Current Status

Completed. We could successfully demonstrate the function of our design and deliver a demo switch system. The testing on the MOEMS switch breadboard and tests-bed was performed on a 10×10 sub-matrix selected among full connected optical inputs and outputs.

Requirement Object Target Spec. Comments
 RF Requirements
 Frequency band  Ka-band  OK alsofor S band
 RF Input Power  >0 dBm  OK fr Ka and S band
 Opto-microwave gain  0 dB  OK for Ka and S band
 Opto-microwave noise figure  <28 dB  OK for Ka band
 C/I ratio (2 tones)  >50dBc  OK for S band, not for Ka band
 Return Loss  >20 dB  OK for Ka band
 Static Isolation  >50 dB  >70 dB
Requirement Object Target Spec. Comments
System Level Requirements
 Number of I/O ports  >50 x 50 Partial 24×24
Full connectivity 10×10.
Switching time  < 5 ms 65 ms
Time for reconfiguration  < 50 ms 100 ms
Mass  < 1kg 0.86 kg
Size  < 1000 cm3 1400 cm3
Power consumption  < 5 W 6.01 W
Optical Requirements
Wavelength range  1.25–1.63µm 1.25-1.63 µm (measurements performed @ 1.55µm)
Insertion loss absolute value  < 7dB < 6.2 dB
Insertion Loss variation  TBD < 0.5 dB
Repeatability of loss  < 1 dB < 0.06dB
Stability of loss  < 1 dB < 0.9 dB
Max Power  21 dBm  
Return Loss (back-reflection)  > 30 dB 15 – 30 dB
Isolation (crosstalk)  > 50 dB > 70 dB
Polarization dependent loss (PDL)  < 0.1 dB < 0.17 dB

The results obtained during the project encouraged sercalo to start a new project on single 2D analogue driven tilt mirrors for ground based applications, like tunable filters, micro scanners or low cost spectrometers and to commercialize a 25 port fiber collimator for rotary joint applications. Future work will tackle environmental testing at chip and equipment level, yield of MEMS chips, etc.