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Objectives
The objective of the project is to develop a means of mounting a number of matrix power amplifiers (MPAs) into a common mechanical and thermal assembly for mounting onto a payload with the overall aim of reducing RF losses and payload AIT cost.
Challenges
The key issues to be addressed by this project were:
- Development of a payload mounting structure.
- Development of MPA mounting techniques.
- Mechanical testing of the overall structure.
- Thermal testing of the overall structure.
- RF testing to measure losses and compare with heritage assembly techniques.
Plan
The project kicked-off as a CCN in November 2004.
A BDR was held in May 2005, and CDR in February 2006; the project was closed in summer 2006.
Current Status
The project kicked-off on 17 November 2004, passed BDR, and was stopped at CDR when the modelling predicted that a second iteration of the mounting structure would be required.