Objective: The objective of the activity is to develop and test different sized packaging solutions with optical and electronic feed-throughs, which allow commercial photonic chips to be deployed in space. Targeted Improvements: By developing innovative packagingtechniques, some types of high-volume parts developed for terrestrial telecommunications markets can be made available for space. Description: This activity aims to establish a packaging process suitable for hybrid (active and passive components) assembly of photonic modules to be used in laser communications systems and for quantum key distribution. The aim is to harness the performance of terrestrial telecom photonics at chip level and package them into a device which can be qualified for space. The packaging processes shall include the basic elements needed for hybrid photonic modules, most notably including; optical interfaces at package and chip level, hermetic sealing options with verifiable seal quality, and RF interfaces. A small selection of demonstrator modules shall be produced, with different functionalities (e.g. receiver, transmitter, laser diodes, monitor photodiodes, mode combiners/splitters, fibre collimators). These modules should be produced in cooperation with chip, package and other parts supplier, with a high degree of automation in the assembly processes. The end result is targeting devices with high performance, which can be qualified for space and having flexibility for future modifications and re-designs. Also to have a set of modularised packaging design elements, a dedicated process for assembly and evaluation of sample devices. The tasks envisioned for implementing this activity include: Trade-off and selection of components/modules to be assembled for the evaluation program and packaging processes. 5 module designs shall be produced demonstrating the different functionalities, packaging elements and targeting next-generation performances, Package design foreach module, simulation of thermo-mechanical and optical performances, Manufacturing and assembly, evaluation tests covering mechanical and environmental aspects for laser communication applications. Procurement Policy: C(1) = Activity restricted to non-prime contractors (incl. SMEs). For additional information please go to:…

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