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StatusOngoing
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Activity Code5F.035
The AutoMAIT project focuses on creating automated processes for attaching micro-optic to photonic integrated circuits (PICs) aimed at satellite applications. Objectives include enhancing assembly reliability and repeatability, improving optical coupling efficiency, reducing manual degrees of freedom, and developing processes that withstand harsh environmental conditions like thermal cycling and vibration. The project advances these packaging processes to a technology readiness level (TRL5), enabling high-volume manufacturing for the price-sensitive Non-Geostationary Orbit (NGSO) market and supporting MBRYONICS' STARCOM and TeraBIX product lines.
The AutoMAIT project encompasses challenges in developing automated micro-optic attachment processes for photonic integrated circuits. Key issues include achieving reliable and repeatable assembly, reducing the degrees of freedom in current processes, and improving optical coupling efficiency. Ensuring the processes and components could withstand harsh environmental conditions, like thermal cycling and vibration, was also a significant hurdle. The report also discusses the need for future production automation to meet market demands.
The AutoMAIT project adopts a process-oriented approach to automate the attachment of micro-optics for photonic integrated circuits designed for satellite applications. Key benefits include improved assembly reliability and repeatability, which are essential for high-volume manufacturing. The project emphasises enhancing optical coupling efficiency and minimising manual intervention, thereby streamlining the overall process. The developed methods are tailored for the cost-sensitive NGSO market and support MBRYONICS' STARCOM and TeraBIX product lines. Additionally, this approach ensures durability against harsh environmental conditions, which is critical for space applications.
The AutoMAIT project focuses on developing automated micro-optic attachment processes for photonic integrated circuits (PICs). The key capabilities include automated epoxy deposition with precise volume control, flip-chip based alignment for both micro-lenses and fiber arrays, and optical feedback mechanisms for accurate alignment and coupling efficiency optimisation. The system utilises a Finetech Lambda 2 flip-chip bonder and custom fixtures designed for thermal bonding and testing. Components include specifically designed PICs, lensed fibre arrays, and various epoxy types. Post-process testing involves die shear tests, mechanical shock and vibration testing, thermal cycling, and TVAC testing, ensuring the processes meet stringent environmental requirements for satellite applications.
The AutoMAIT system focuses on automating the micro-optic attachment process for photonic integrated circuits (PICs) used in satellite applications. The core of the system revolves around a Finetech Lambda 2 flip-chip bonder, which provides precise placement and alignment capabilities. This bonder is enhanced with custom-designed fixtures for thermal bonding and environmental testing.
The architecture includes automated epoxy dispensing for controlled application of adhesive. Optical feedback mechanisms are integrated for real-time monitoring and optimization of optical coupling during the alignment process. Specifically designed PICs, lensed fibre arrays, and various epoxy types are key components. The system undergoes rigorous post-process testing, including die shear, mechanical shock and vibration, thermal cycling, and TVAC (thermal vacuum) testing to ensure reliability in harsh space environments.
The AutoMAIT project phases include developing flip-chip based micro-lens and fibre array attachment processes for photonic integrated circuits. Key milestones involve design considerations for reduced degrees of freedom in optical alignment, automated epoxy deposition, and curing processes. Post-process testing was conducted, including die shear, mechanical shock and vibration, thermal cycling, and TVAC testing to evaluate the processes' effectiveness and environmental resilience for satellite applications. Additionally, the project included roadmapping and business development strategies for future automation and market engagement.
The AutoMAIT project has developed and tested automated photonic packaging processes for satellite communications, focusing on improving optical coupling efficiency and reliability for high-volume manufacturing. Testing, including die shear, mechanical shock, vibration, thermal cycling, and TVAC, has been completed. The report also outlines future roadmapping and business development strategies, including plans for production automation, market analysis, and customer engagement, with a focus on supporting MBRYONICS’ STARCOM and TeraBIX product lines.