PAGE CONTENTS
Objectives
- Development of a Microelectronics Platform to enable mixed mode ASIC’s using a radiation-hardened-by-design solution for XFAB CMOS 0.18µ technology node
- Design, manufacturing, test and qualification of generation 1 DPC (Digital Programmable Controller) chips based on mainly available mixed mode ASIC microelectronics technology UMC-DARE
Challenges
The main challenges are related to the product innovation and development complexity associated with developed mixed-signal radiation hardened ASIC, with very broad functionality and high-level performance. As far as known, the DPC being an integrated Rad-Hard mixed signal microcontroller is a world première.
Plan
DPC G1 development is now completed. Focus is now on qualification testing and applications.
XFAB technology Platform is now under development. Platform Evaluation test vehicle has just been taped out.
Current Status
DPC G1 Final review successful.
XFAB Technology Platform development on going.
For information: DPC G1 Qualification on-going under Artes C&G contract.
