3D MOLDED INTERCONNECT DEVICE (3D MID) CHARACTERISATION FOR SPACE TELECOM APPLICATIONS (ARTES 5.1 4A.056)

Description

The objective of the activity is to characterise the suitability of 3D MID for space applications.

Targeted Improvements: 3D MID would allow complex shapes, leading to the removal of part of the spacecraft harness and unit housing. The overall equipment plus harness mass and AIT time should be reduced by 10%. The overall occupied volume by an attitude sensor could be reduced by 50%.

A molded interconnect device (MID) is an injection-molded thermoplastic part with integrated electronic circuit traces. It opens a new dimension of circuit carrier design to the electronics industry.

Key markets for the MID technology are consumer electronic, telecommunication, automotive and medical. A very common application for MIDs are integrated antennas in cellphones and other mobile devices including laptops and netbooks.

Spacecraft harness mass is more and more critical. In addition, the accommodation constraints could lead to non optimised design. An MID enabled design would also allow a more efficient AIT process.

The following work logic is proposed:

  1. market survey, state of the art;
  2. selection of space application examples (e.g. attitude sensors, antennas...);
  3. manufacturing of several prototypes
  4. characterisation in terms of thermal behaviour, emc, reliability, material suitability to space applications;
  5. road map for space qualification.

Procurement Policy: C(2) = A relevant participation (in terms of quality and quantity) of non-primes (incl. SMEs) is required. For additional information please go to EMITS news "Industrial Policy measures for non-primes, SMEs and R&D entities in ESA programmes".

Tender Specifics